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Technology Transfer: New Approach

In order to widen the impact of technology transfer and increase the opportunities for collaboration with industry, the ACCA Group is following a new approach for technology transfer.

This approach consists of becoming an active member of an industry standards consortium, thus opening the door for industrial collaboration and technology transfer that becomes visible and useful for all the companies in the consortium at once. Moreover, by collaborating with a standards consortium, we make sure that once the transferred technology is standardized, it becomes a stable technology that can be incorporated in multiple products from different companies in a compatible manner.

The benefits of this approach are:

  • Much wider applicability of the transferred technology: Many member companies can benefit from it
  • Technology is standardized, leading to open systems, product stability, and lower cost

It also requires a much higher effort:

  • Technology must be standardized (i.e., filtered by member companies through the Technical Working Group)
  • Technology is only standardized when a potential market for it is detected


Along this new approach, the UPV, UCLM, and UM have become members of the HyperTransport Technology Consortium (HTC), an industry consortium formed by leading companies such as AMD, Sun, HP, Dell, Nvidia, Cray, IBM, etc.

The role of the ACCA Group within HTC is a crucial one. The HTC has created the Advanced Technology Group (ATG) in order to develop enhancements to HyperTransport technology, which will later be standardized by the Technical Working Group (TWG). The Project Coordinator Dr. José Duato is the spokesperson and main drive of the ATG. The main results up to now are a set of compatible extensions to the HyperTransport specifications, the High Node Count HyperTransport Specification 1.0, that were approved by the TWG on February 2009, and now constitute the leading technology being promoted and licensed by the HyperTransport Consortium. Additional results include the standardization in December 2009 of two new HyperTransport connector/cable specifications that enable more innovative ways of interconnecting HyperTransport enabled devices. These specifications standardize a physical layer that complements the High Node Count specification.

This new approach to technology transfer was presented during the UIMP Summer School organized by the Consolider Ingenio 2010 Program coordinators, in Santander (Spain), on 21st of July, 2009.